• Genel Bakış
  • Açıklama
  • Sipariş Bilgileri
  • İndirmeler
Android Panel PC

OVPPC-119-A33

Fanless Android Panel PC RK3399, Dual-core Cortex-72 up to 1.8GHz, Quad-core Cortex-A53 up to 1.4GHz

  • The front frame is only 3mm thick, specially designed for embedded installation applications.
  • High precision die-casting aluminım molding, pure plane wire drawing process design, dustproof and waterproof.
  • Independent research and development of ARM architecture industrial motherboard, with a variety of options.
  • Conform to EMC anti electromagnetic interference standard.
  • Industrial protection, applicable to various harsh enviroments.
  • SDK package is provided to support secondary development and upgrade customization.
Destekleyen İşlemciler
  • OVPPC-119-A33
Android Panel PC

OVPPC-119-A33

The front panel is made of pure flat wire drawing process, which is dustproof and waterproof. The whole machine has low power consumption, good scalability, practicability, EMC compatibility and other performances.

Sipariş Bilgileri

OVPPC-119-A33

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